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What is TOSA (Transmitter Optical Subassembly)?
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Author : JIUZHOU
Update time : 2024-11-07 16:49:44
It is the abbreviation of Transmitter Optical Subassembly, which is mainly used to convert electrical signals into optical signals (E/O conversion). The performance indicators include optical power, threshold, etc.
The relevant introduction of TOSA (Transmitter Optical Subassembly) is as follows:
Optical transmission module: There are two types of single-mode optical transmission module and multi-mode optical transmission module. The overall product architecture includes two major parts: optical submodule and electronic submodule.
First, the epitaxial part uses gallium arsenide, indium phosphide, indium gallium arsenide, etc. as light-emitting and light-detecting materials. They are made into epitaxial wafers using methods such as organic metal vapor deposition. In the chip manufacturing process, laser diodes are then made.
The laser diode is then matched with components such as filters and metal covers. The package is made into a TO can, and then this TO can and components such as ceramic sleeves are packaged into an optical submodule (OSA).
Finally, it is matched with an electronic submodule (ESA), which contains two driver ICs for transmission and reception. This is used to drive the laser diode and the photodetector diode, and the combination forms an optical transmission module.
The optical submodule can be further divided into the optical transmitter submodule and the optical receiver submodule.
The main performance indicators of TOSA: optical power value (Po), center wavelength (λc) and other performance indicators. The commonly used unit of optical power is mW (or uW); the unit of center wavelength is nm, and common wavelengths are λc=850nm, λc=1310nm, λc=1490nm, λc=1550nm, etc.
The above is an introduction to TOSA (optical transmitter submodule).
The relevant introduction of TOSA (Transmitter Optical Subassembly) is as follows:
Optical transmission module: There are two types of single-mode optical transmission module and multi-mode optical transmission module. The overall product architecture includes two major parts: optical submodule and electronic submodule.
First, the epitaxial part uses gallium arsenide, indium phosphide, indium gallium arsenide, etc. as light-emitting and light-detecting materials. They are made into epitaxial wafers using methods such as organic metal vapor deposition. In the chip manufacturing process, laser diodes are then made.
The laser diode is then matched with components such as filters and metal covers. The package is made into a TO can, and then this TO can and components such as ceramic sleeves are packaged into an optical submodule (OSA).
Finally, it is matched with an electronic submodule (ESA), which contains two driver ICs for transmission and reception. This is used to drive the laser diode and the photodetector diode, and the combination forms an optical transmission module.
The optical submodule can be further divided into the optical transmitter submodule and the optical receiver submodule.
The main performance indicators of TOSA: optical power value (Po), center wavelength (λc) and other performance indicators. The commonly used unit of optical power is mW (or uW); the unit of center wavelength is nm, and common wavelengths are λc=850nm, λc=1310nm, λc=1490nm, λc=1550nm, etc.
The above is an introduction to TOSA (optical transmitter submodule).
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